Backlit illumination of electronics
US10394340B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2019 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Jan 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A backlit device includes an outer layer, an adhesive layer, and a light guide configured to transmit light from a light source. The adhesive layer is positioned between the outer layer and the light guide. The outer layer includes a plurality of outer layer segments and at least one opening positioned between the outer layer segments where light from the light guide can pass through and provide backlighting. The adhesive layer includes a plurality of adhesive material segments. Each adhesive material segment is individually positioned between an outer layer segment and the light guide such that the perimeter of an outer layer segment surrounds the perimeter of the respective adhesive material segment. Through this arrangement, the adhesive material segments do not divert or block light passing through the opening in the outer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.