Fan-out fingerprint sensor package
US10395088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2018 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Mar 15, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.