Non-destructive multi-resolution surface clipping
US10395419B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2017 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Oct 11, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2210/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In an example embodiment, a technique is provided for surface mesh clipping. A surface mesh file and clip objects are received, and a unique identifier of a clip object is added to each node of a spatial index of the surface mesh that intersects the respective clip object. For any currently visible nodes, clip geometries and a series of meshes that partition the node into clipped regions are computed and stored in a clip file separate from the surface mesh file. Any non-currently visible nodes are computed and the clip file updated in response to display of the respective node. A clipped surface mesh is rendered by assembling regions of the surface mesh that are not affected by clip objects and clipped regions from the clip file, and the rendered clipped surface mesh is displayed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.