Composite substrate for layered heaters
US10395953B2 · kind B2 · utility
0Cited by
9References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2015 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Oct 21, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heater assembly for use in semiconductor processing that includes an application substrate; a heater substrate secured to the application substrate by a thermal bonding process; and a functional layer disposed onto the heater substrate by a layered process. In this heater assembly, the heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.