Patent · US Active

Package for an optical sensor, optical sensor arrangement and method of producing a package for an optical sensor

US10396111B2 · kind B2 · utility

0Cited by

8References

19Claims

0Family size

Assignee

AMS AG · AT

Inventors

Arnold UMALI · Calamba, PH
Harald Etschmaier · Graz, AT
Guenter Aflenzer · Graz, AT

Key dates

Filing date	Jun 25, 2014
Grant date	Aug 27, 2019
Priority date	—
Expiry date	Jun 25, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/8063
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package for an optical sensor, comprises an optically opaque enclosure for forming a cavity when mounted onto a substrate and an optical element based on an optically translucent polymer. An aperture in the enclosure is designed to attach the optical element to the enclosure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.