Method for forming apparatus comprising two dimensional material
US10396180B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Aug 25, 2016 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Aug 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus, the method comprising: forming at least two electrodes (23) on a release layer wherein the at least two electrodes are configured to enable a layer of two dimensional material (25) to be provided between the at least two electrodes; providing moldable polymer (27) overlaying the at least two electrodes; wherein the at least two electrodes and the moldable polymer form at least part of a planar surface (29).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.