Self-assembly pattering for fabricating thin-film devices

US10396218B2 · kind B2 · utility

Assignees

• FLISOM AG · CH
• EMPA · CH

Inventors

• Patrick Reinhard · Zürich, CH
• Benjamin Bissig · Altdorf, CH
• Stephan Buecheler · Bösingfeld, DE
• Ayodhya Nath Tiwari · Meilen, CH
• Fabian Pianezzi · Stintenberger Straße, CH

Key dates

• Filing date: Sep 2, 2015
• Grant date: Aug 27, 2019
• Expiry date: Sep 18, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method (200) for fabricating patterns on the surface of a layer of a device (100), the method comprising: providing at least one layer (130, 230); adding at least one alkali metal (235); controlling the temperature (2300) of the at least one layer, thereby forming a plurality of self-assembled, regularly spaced, parallel lines of alkali compound embossings (1300, 1305) at the surface of the layer. The method further comprises forming cavities (236, 1300) by dissolving the alkali compound embossings. The method (200) is advantageous for nanopatterning of devices (100) without using templates and for the production of high efficiency optoelectronic thin-film devices (100).