Radiation-emitting semiconductor component and production method of a plurality of semiconductor components

US10396259B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Matthias Sperl · Mintraching, DE
• Frank Singer · Regenstauf, DE
• Jürgen Moosburger · Regensburg, DE

Key dates

• Filing date: Apr 5, 2016
• Grant date: Aug 27, 2019
• Expiry date: Apr 6, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8582

Abstract

A radiation-emitting semiconductor component and a method for producing a plurality of semiconductor components are disclosed. In an embodiment the component includes a semiconductor chip comprising a semiconductor layer sequence, a front side and a rear side opposite the front side, and a molded body molded on to the semiconductor chip at least in some places. The component further includes a thermal connector located on a rear side of the semiconductor component, wherein the rear side of the semiconductor component is opposite the front side of the semiconductor chip, wherein the thermal connector extends to the rear side of the semiconductor chip, wherein at least one electrical connection surface is located on the front side of the semiconductor chip, and wherein the at least one electrical connection surface is electrically-conductively connected to an electrical contact surface of the semiconductor component via a contact path running on the molded body.