Wireless system architecture with dependent superstrate for millimeter-wave phased-array antennas
US10396470B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 16, 2018 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Mar 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/065
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A wireless communications assembly includes: a primary board including: (i) an upper surface bearing a radio controller, and defining a set of control contacts for connection to respective ports of the radio controller; (ii) a lower surface opposite the upper surface, the lower surface defining a plurality of antenna contacts; (iii) a plurality of conduits extending through the primary board from the antenna contacts to the control contacts; and (iv) an antenna ground plane; a superstrate board including: (i) an inner surface facing the lower surface of the primary board; (ii) an outer surface opposite the inner surface; (iii) a phased array of antenna elements disposed on the inner surface; and a surface-mount package between the lower surface and the inner surface for connecting a subset of the antenna contacts directly to the antenna elements and to provide a substrate between the antenna elements and the antenna ground layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.