Stacked wafer-level packaging devices
US10396753B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2017 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Aug 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B1/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Stacked wafer-level packaging devices. In some embodiments, a wireless device includes a transceiver configured to generate a radio-frequency (RF) signal. The wireless device also includes a front-end module (FEM) in communication with the transceiver, the front-end module including a packaging substrate configured to receive a plurality of components, the front-end module further including a stacked assembly implemented on the packaging substrate, the stacked assembly including a first wafer-level packaging (WLP) device having a radio-frequency (RF) shield, the stacked assembly further including a second wafer-level packaging device having an RF shield, the second wafer-level packaging device positioned over the first wafer-level packaging device such that the RF shield of the second wafer-level packaging device is electrically connected to the RF shield of the first wafer-level packaging device. The wireless devices further includes an antenna in communication with the front-end module, the antenna configured to transmit the amplified radio-frequency signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.