Housing for an electronic control unit and method of manufacture
US10398021B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2017 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Aug 1, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A housing assembly for an electronic circuit including an electronic control unit (ECU) is a low-profile, generally rectangular device that includes a base, a cover that closes an open end of the base, and a printed circuit board (PCB). The housing assembly securely supports the PCB and its associated electronic components while providing improved cooling properties and lower manufacturing costs. This is achieved by providing passive cooling features on an outer surface of the cover, and by employing a thermally conductive plastic to form the passive cooling features, where the cover has predetermined and defined anisotropic thermal conduction properties configured to optimize thermal conduction and cooling of the ECU.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.