Material processing system with low-inertia laser scanning and end effector manipulation
US10399178B2 · kind B2 · utility
2Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2013 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Jun 11, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S901/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus includes a robotic manipulator with a stationary base, and an end effector actuated by the robotic manipulator, wherein the end effector is adjacent to a workpiece. A scanning laser head unit includes a laser and an optical train configured to move a laser beam over the workpiece. A control unit is configured to move the robotic manipulator such that movement of the end effector tracks movement of the laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.