Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
US10399186B2 · kind B2 · utility
2Cited by
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35Claims
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Key dates
| Filing date | Apr 15, 2015 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Mar 12, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lead-free solder alloy contains zinc (Zn) as the main component and aluminum (Al) as an alloying metal. The solder alloy is a eutectic having a single melting point in the range of 320 to 390° C. (measured by DSC at a heating rate of 5° C. min-1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.