Sealed circuit card assembly
US10399256B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2018 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Apr 25, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a sealed circuit card assembly includes disposing a circuit card assembly within a volume defined by a housing and at least partially filling the volume with a curable liquid such that the curable liquid encapsulates at least a circuit card. The method may also include curing the curable liquid to form a potted circuit card assembly and, after at least partially filling the volume with the curable liquid and after curing the curable liquid, vacuum impregnating the potted circuit card assembly with a sealant to seal any exposed interfaces or cracks to form the sealed circuit card assembly. Accordingly, the sealed circuit card assembly may include a first cured material encapsulating the circuit card of the circuit card assembly and a second cured material disposed within, for example, a porosity of the first cured material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.