Device and method for printing silicon sealant
US10399328B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 5, 2016 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Aug 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K30/88
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A device for printing silicon sealant, including a coating device, a horizontal coating stage, and an elevating device, wherein: the elevating device is connected with the horizontal coating stage and is configured to adjust the height of the horizontal coating stage; the horizontal coating stage can be moved to a position right below a screen and fully contacted with the screen under the adjustment of the elevating device; and the coating device is configured to be moved to a position above the screen to coat silicon sealant in a pattern area of the screen after the horizontal coating stage is fully contacted with the screen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.