Patent · US Active

Re-closure tape application on packaging machine

US10399722B2 · kind B2 · utility

0Cited by
26References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 10, 2018
Grant dateSep 3, 2019
Priority date
Expiry dateOct 10, 2038

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2301/408
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A tape closure system is shown and described herein. The tape closure system includes a first tape component having a pressure sensitive adhesive and a second tape component having a pressure sensitive adhesive, where at least one of the pressure sensitive adhesives has a modified surface to reduce the tack of the surface such that when the first and second pressure adhesives are brought into contact with one another they may sufficiently adhere to one another to form a seal but are still separable from one another and able to be repeatedly opened and sealed. Such a tape may be manufactured through high speed manufacturing processes and wound into large master rolls. In the roll configuration, the modified surface contacts the backside of the liner and experiences compressive forces in the roll. Due to the compressive forces, a part of the modified surface may get pushed into the PSA, thereby affecting the properties of the modified adhesive. An embodiment of this invention provides an embossed liner with spacers that nest the modified adhesive surface when it is self-wound, thereby preventing the deterioration of the adhesive properties. An embodiment of the invention is a method …

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.