Method for determining the layer thickness of a connecting layer between two packaging layers

US10401160B2 · kind B2 · utility

Assignees

• Constantia Teich GmbH
• Research Center for Non Destructive Testing GmbH · AT

Inventors

• Bernhard REITINGER · Eferding, AT
• Saeid Zamiri · Linz, AT
• Clemens Gruensteidl · Linz, AT
• Juergen Roither · Eferding, AT
• Martin Kornfeld · Klosterneuburg, AT
• Alfred Wegenberger · Langenlois, AT

Key dates

• Filing date: Mar 12, 2014
• Grant date: Sep 3, 2019
• Expiry date: Oct 13, 2034

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2291/02854
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

For a simple, fast, safe and reliable determination of the layer thickness of a bonding layer between two layers of a packaging, a laser ultrasonic method is provided, in which the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is determined in advance, and a maximum (M1, M2, Mn) in the measurement signal (S) is sought, and the point in time of occurrence of this maximum (M1, M2, Mn) is determined as the total transit time (T1, T2, Tn) of the ultrasonic wave, and the transit time of the ultrasonic wave through the first and second packaging layers (2, 3) is subtracted from the total transit time (T1, T2, Tn), and the thickness (d) of the bonding layer is deduced from the known ultrasonic speed (vS) in the bonding layer (5).