Power module with multi-layer substrate
US10403558B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2017 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Nov 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02P27/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power system has a single-side-cooled power module including a contiguous five-layer substrate of two insulative layers interleaved with three conductive layers. A center one of the conductive layers is partitioned to define discrete spaced apart positive terminal and output terminal portions, and an outer of the conductive layers defines a negative terminal portion such that the positive terminal and negative terminal portions overlap. The power system also has semiconductors respectively in direct contact with the positive terminal and output terminal portions without directly contacting the other layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.