Wafer-level optical modules and methods for manufacturing the same
US10403671B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 8, 2014 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Dec 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/52
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method for manufacturing a plurality of optical modules each comprising a first (C1) and a second (C2) optical component comprises the steps of a) providing a first substrate wafer (S1) on which a plurality of the first optical components (C1) is present on a top side of the first substrate wafer; b) providing a second substrate wafer (S2) having a material region which is a continuous laterally defined region in which material of the second substrate is present, wherein a plurality of the second optical components (C2) is present in said material region; c) achieving a lateral alignment of the first (S1) and second (S2) substrate wafers such that each of the first optical components (C1) is present in a laterally defined region not overlapping said material region; d) interconnecting the first and second substrate wafers in said lateral alignment such that the top side of the first substrate wafer faces a bottom side of the second substrate wafer with no further wafer in between. This way, first and second optical components may be placed particularly close to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.