Patent · US Active

Conductive paste composition and semiconductor devices made therewith

US10403770B2 · kind B2 · utility

0Cited by

22References

23Claims

0Family size

Assignee

E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

Michael Stephen Wolfe · Wilmington, US
John D. Summers · Chapel Hill, US
Bryan Benedict Sauer · Boothwyn, US
Hoang Vi Tran · Wilmington, US
Brian D. Mather · San Diego, US
Hee Hyun Lee · Wilmington, US
Esther Kim · Lompoc, US
Ma Helen Cativo · Wilmington, US
Yuefei Tao · Hockessin, US

Key dates

Filing date	Feb 4, 2016
Grant date	Sep 3, 2019
Priority date	—
Expiry date	Feb 4, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/50
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.