Structure with micro device
US10403799B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2018 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Dec 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68368
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure with micro device including a substrate, at least one micro device, at least one holding structure, and at least one buffering structure is provided. The micro device is disposed on the substrate and has a top surface away from the substrate, a bottom surface opposite to the top surface, and a circumferential surface connecting the top surface and the bottom surface. The holding structure is disposed on the substrate. From the cross-sectional view, a thickness of the holding structure in a normal direction of the substrate gradually increases from the boundary of the top surface and the circumferential surface to the substrate. The buffering structure is disposed between the holding structure and the substrate. The holding structure is connected to the substrate through the buffering structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.