Coil substrate
US10404091B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2016 |
| Grant date | Sep 3, 2019 |
| Priority date | — |
| Expiry date | Feb 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02J2310/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil substrate for wireless power transmission includes: an insulating substrate including a first surface and a second surface; a first wiring portion disposed on the first surface, wherein the first wiring portion includes first spiral patterns and a section in which opposing ends of each of the first spiral patterns are disposed parallel to each other; a second wiring portion disposed on the second surface and including second spiral patterns, wherein opposing ends of each of the second spiral patterns are spaced apart from each other; and conductive vias alternately connecting the first spiral patterns and the second spiral patterns to each other to form coil turns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.