Curing apparatus and curing method
US10406557B2 · kind B2 · utility
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1References
17Claims
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Key dates
| Filing date | May 18, 2016 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Aug 5, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2505/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.