Thermoplastic bonded preforms and thermoset matrices formed therewith
US10406776B2 · kind B2 · utility
1Cited by
4References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2017 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Dec 29, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermoplastic bonded preform and method of manufacturing the preform are disclosed. The preform comprises a primary fiber comprising little or no sizing; a mechanical fiber; and a thermoplastic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.