System and method for testing bonded joints
US10408719B2 · kind B2 · utility
2Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2017 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Feb 28, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/026
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for testing bonded joints that comprises a swing tool, an actuator, pressure measuring device and a first fixing arrangement. The actuator of the system is configured to apply a compression force or a traction force on the swing tool in order to separate two elements, and the pressure measuring device is configured to measure the force applied on the swing tool. A method for testing bonded joints using the system is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.