Patent · US Active

Proof testing brittle components of electronic devices

US10408722B2 · kind B2 · utility

0Cited by
8References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 29, 2016
Grant dateSep 10, 2019
Priority date—
Expiry dateAug 12, 2037

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01M99/00
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Methods and a system for proof testing brittle components of electronic devices are disclosed. The method may include positioning the brittle component relative to a probe of a testing system, contacting the probe to a surface of the brittle component at a first location, and applying a first force at the first location using the probe to create a first localized tensile band below the surface of the brittle component. The method may also include contacting the probe to the surface of the brittle component at a second location, distinct from the first location, and applying a second force at the second location using the probe to create a second localized tensile band below the surface of the brittle component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.