Method of providing an electronic device and electronic device thereof
US10410903B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2017 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Dec 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68386
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments include a method. The method can include: providing a carrier substrate; providing a bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate and the bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the bond promoting layer, the first device substrate bonding to the bond promoting layer with a first device substrate-bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.