Method for production of components comprising a schottky diode by means of printing technology
US10411142B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2016 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Mar 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D99/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns a method for production of components comprising a Schottky diode by means of printing technology. The method involves a step of application and deposition of a semiconductor-nanoparticle dispersion on a first electrode, which is disposed on a substrate, the step of exposure to laser light of the deposited semiconductor-nanoparticle dispersion to form a mu-cone with a bottom and a tip, wherein the bottom of the mu-cone is joined to the first electrode, the step of embedding the thus-formed mu-cone in an electrically insulating polymer matrix, and the step of applying a second electrode, so that the tip of the mu-cone is joined to the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.