Light emitting element package and method of manufacturing the same
US10411175B2 · kind B2 · utility
0Cited by
13References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2016 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Dec 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.