Circuit components and methods for manufacturing the same and bonding devices
US10412823B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 22, 2017 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Sep 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure discloses a circuit component and a method for manufacturing the same and a bonding device. The circuit component comprises a first circuit board and a second circuit board, wherein at least one of the first circuit board and the second circuit board comprises a bonding detection layer configured to be capable of detecting a bonding parameter between the first circuit board and the second circuit board; and emitting a detection signal when the bonding parameter reaches a preset value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.