Heat capture system for electrical components providing electromagnetic pulse protection
US10412860B1 · kind B1 · utility
2Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2016 |
| Grant date | Sep 10, 2019 |
| Priority date | — |
| Expiry date | Nov 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes an electrically-powered component, a hermitically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a liquid bath surrounding the hermitically-sealed container. The electrically-powered component can include a computer motherboard, a central processing unit of a computer, or an electrical power transformer. The container can include a substance in direct contact with the electrically-powered component and can include a silicone compound, an epoxy compound, or a polyurethane compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.