Ultrasound probe and manufacturing method thereof
US10413275B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2015 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Dec 16, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/76
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Disclosed herein is an ultrasound probe including a transducer array configured to generate ultrasonic waves, an integrated circuit disposed on a back surface of the transducer array by using an adhesive member, a printed circuit board connected to the integrated circuit and configured to output a signal to the integrated circuit, and a pad bridge disposed on front surfaces of the printed circuit board and the integrated circuit by using the adhesive member and configured to electrically connect the printed circuit board with the integrated circuit. An area of a region of the ultrasound probe contacting the human body may be reduced without reducing the size of the transducer array, and the integrated circuit and the printed circuit board may be integrally connected by using the adhesive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.