Biofilm resistant medical implant
US10413640B2 · kind B2 · utility
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1References
14Claims
0Family size
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Key dates
| Filing date | Jul 25, 2014 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Jun 15, 2036 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L2430/02
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of incorporating silver and/or copper into a biomedical implant includes: providing an implant having an outer surface; depositing silver and/or copper onto the outer surface of the implant; diffusing the silver and/or copper into a subsurface zone adjacent the outer surface; and oxidizing or anodizing the implant after the diffusion step to form an oxidized or anodized layer that contains at least some amount of elemental silver, elemental copper or silver or copper ions or compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.