Hall sensor mounting in an implantable blood pump
US10413650B2 · kind B2 · utility
0Cited by
152References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2016 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Jan 26, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.