Grindstone and grinding/polishing device using same
US10414020B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2013 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Sep 27, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/228
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
[Problem] To provide a grindstone and a grinding/polishing device using same with which, in addition to it being possible to perform the three processes of rough processing, lapping, and polishing with the same device: double-sided processing is also possible; processing rate does not decrease even when used continuously; and dressing can be omitted.[Solution] A grindstone for grinding/polishing workpieces, the grindstone being characterized in comprising multiple grindstone pillars, which are obtained from a binding agents and abrasive grains for grinding/polishing the workpieces and disposed in parallel with an axis (L) in the depth direction of the grinding/polishing surface, and the grindstone matrix integrally formed with the grindstone pillars, and a grinding/polishing device using said grindstone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.