Patent · US Active

Low-stress line workpiece and method for integrally forming the same

US10414122B2 · kind B2 · utility

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Key dates

Filing dateMar 15, 2017
Grant dateSep 17, 2019
Priority date
Expiry dateJul 14, 2037

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2457/208
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A low-stress line workpiece and a method for integrally forming the same is disclosed. Firstly, an in-mold injection molding mold is provided, wherein a function film, a 3D curved-surface plastic material, and an anti-rainbow stripe combination layer are placed in the in-mold injection molding mold. The in-mold injection molding mold is used to mold the function film, the plastic material and the combination layer into a low-stress line workpiece integrally formed by in-mold forming. The low-stress line workpiece includes the function film, the plastic layer and the combination layer, wherein the plastic layer is located between the function film and the combination layer. The present invention provides a low-stress line workpiece with high surface hardness and a method for forming the same to reduce lamination fabrication processes and improve lamination yield.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.