Patent · US Active

Resin containing phenolic hydroxyl groups, and resist film

US10414850B2 · kind B2 · utility

2Cited by
1References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 17, 2016
Grant dateSep 17, 2019
Priority date—
Expiry dateNov 17, 2036

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08G8/04
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Provided are a resin containing phenolic hydroxyl groups having excellent developability, heat resistance, and substrate followability, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl group. The resin containing phenolic hydroxyl groups obtained by reacting a novolac resin intermediate obtained by reacting a triarylmethane compound (A) with an aldehyde compound (B) as essential components, with an alkene compound (C) having 9 to 24 carbon atoms, a photosensitive composition, a curable composition, and a resist film which contain the resin containing phenolic hydroxyl groups.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.