Epoxy resin system
US10414857B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Mar 17, 2015 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Mar 17, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.