Low application temperature hot melt adhesive composition

US10414957B2 · kind B2 · utility

Assignee

• H.B. Fuller Company · US

Inventors

• Ameara S. Mansour · Woodbury, US
• Kevin P. Davis · Woodbury, US
• David B. Malcolm · Maplewood, US
• Mark S. Kroll · Arden Hills, US
• Steven R. Vaughan · Lake Elmo, US
• Timothy W. Roska · Lake Elmo, US
• Evan Yuan · 流花街道, CN

Key dates

• Filing date: Mar 16, 2016
• Grant date: Sep 17, 2019
• Expiry date: May 29, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2453/00
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

This invention claims low application temperature hot melt adhesive compositions including at least about 15% by weight of a first styrene block copolymer with a melt flow rate of at least about 15 g/10 minutes (190° C., 2.16 kgs) and a diblock content of no greater than about 10% by weight.