Cleaning formulation for removing residues on surfaces
US10415005B2 · kind B2 · utility
8Cited by
23References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2019 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | May 1, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This disclosure relates to a cleaning composition that contains 1) hydroxylamine in an amount of from about 0.5% to about 20% by weight of the composition; 2) a pH adjusting agent, the pH adjusting agent being a base free of a metal ion and in an amount of at most about 3% by weight of the composition; 3) an alkylene glycol; and 4) water; in which the pH of the composition is from about 7 to about 11. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.