Defect inspection method and apparatus using micro lens matrix

US10416091B2 · kind B2 · utility

Assignees

• Semiconductor Manufacturing International (Shanghai) Corporation · CN
• Semiconductor Manufacturing International (Beijing) Corporation · CN

Inventors

• Qiang Wu · 流花街道, CN
• Wei Xiong · Madison, US
• Xuan Li · Ditzingen, DE

Key dates

• Filing date: Sep 15, 2017
• Grant date: Sep 17, 2019
• Expiry date: Sep 27, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/12
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A substrate surface defect detection device includes an optical waveguide for receiving first light and directing the received first light to a surface of a to be tested substrate, the optical waveguide having a first surface facing toward the substrate and a second surface facing away from the substrate, a microlens array disposed on the second surface of the optical waveguide, the microlens array including a plurality of microlenses arranged in an array for receiving second light from the surface of the to be tested substrate and converging the received second light to converged light, and an imaging component for receiving the converged light from the at least one microlens array for optical imaging. The substrate surface defect detection device requires significantly less time than conventional substrate surface defect detection devices.