Power module
US10418295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2016 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Nov 4, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D12/411
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module includes an insulated circuit board, a semiconductor element, a first buffer plate, and first and second joining materials. The semiconductor element is disposed on a side of one main surface of the insulated circuit board. The first buffer plate is disposed between the insulated circuit board and the semiconductor element. The first joining material is divided into a plurality of portions in a plan view. The first buffer plate is higher in coefficient of linear expansion than the semiconductor element and lower in coefficient of linear expansion than the insulated circuit board. The first buffer plate is lower in Young's modulus than the semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.