Patent · US Active

Chip on film package

US10418305B2 · kind B2 · utility

2Cited by

0References

30Claims

0Family size

Assignee

Novatek Microelectronics Corp. · TW

Inventors

Wen-Ching Huang · Taipei, TW
Chien-Chen Ko · Hsinchu, TW
Ling-Chieh Li · Bellevue, US

Key dates

Filing date	Jan 30, 2019
Grant date	Sep 17, 2019
Priority date	—
Expiry date	Jan 30, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/00014
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chip on film package includes a base film, a patterned circuit layer, a chip and a heat dissipation sheet. The base film includes a first surface and a mounting region located on the first surface. The patterned circuit layer is disposed on the first surface. The chip is disposed on the mounting region and electrically connected to the patterned circuit layer. The heat dissipation sheet includes a first adhesive layer disposed over the base film, a second adhesive layer disposed over the first adhesive layer, and a graphite layer disposed between the first adhesive layer and the second adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer is a double-sided adhesive with carrier, which comprises two adhesives and a carrier disposed between the two adhesives.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.