Mechanical seal and reservoir for microelectronic packages
US10418309B1 · kind B1 · utility
2Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2018 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Jun 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a substrate, a first die, a gasket, and a thermal interface. The first die may be connected to the substrate. The gasket may be connected to the substrate and may encircle the first die to form a space between the first die and the gasket. The thermal interface material may be located within the space formed by the first die and the gasket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.