Light emitting diode package and light emitting diode module
US10418348B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2017 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Nov 11, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B20/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode package including a housing, a first light emitting diode chip and a second light emitting diode chip disposed in the housing, and a wavelength conversion part including a phosphor configured to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than the light emitted from the first light emitting diode chip, in which the light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, and the phosphor has a fluorescence intensity of 10 or less at a peak wavelength of light emitted from the second light emitting diode chip, with reference to a maximum fluorescence intensity of 100 at a wavelength of 425 nm to 475 nm on an excitation spectrum of the second light emitting diode chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.