LED packaging material and manufacturing method of the same
US10418531B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 9, 2017 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Jun 9, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/206
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a light-emitting diode (LED) packaging material, which is formed by compounding the graphene with the silane or the epoxy resin, to improve the defects of manufacturing the LED packaging material of the single silane or the epoxy resin, with the help of the properties of graphene, so as to improve the performance of the LED packaging material. The present invention further provides a manufacturing method of a LED packaging material. The LED packaging material and the manufacturing method of the present invention, which is formed by compounding the graphene with the silane or the epoxy resin, to improve the defects of manufacturing the LED packaging material of the single silane or the epoxy resin, with the help of the properties of graphene, so as to improve the performance of the LED packaging material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.