High-power remote phosphor white LED heat-dissipation package
US10418537B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2019 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Apr 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8583
Abstract
High-power remote phosphor white LED heat-dissipation package relates to an LED heat-dissipation package, for solving the problem of poor heat dissipation of LED package structures. The substrate of the package structure is provided with a boss and a heat conducting ring, and the phosphor structural layer contains hollow glass microspheres. The white LED heat-dissipation package structure in the present invention improves the spatial chroma uniformity of the white light by using the hollow glass microspheres, thereby reducing the costs. The package structure can improve the heat dissipation efficiency of the chip and the utilization ratio of light emitted from the chip. The present invention is applicable to prepare high-power remote phosphor white LEDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.