Microspeaker enclosure with porous materials in resonance space
US10419847B2 · kind B2 · utility
1Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2017 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Jul 8, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2400/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.