Heat pipe embedded heat sink with integrated posts
US10420203B2 · kind B2 · utility
0Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2013 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Dec 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a heat sink and a post that supports the heat sink that is monolithically formed with the heat sink. The apparatus can further include a printed wiring board attached to a top side of the heat sink with electronic components attached to the printed wiring board, a plurality of posts integrated into a bottom side of the heat sink and extending outwards from the heat sink, wherein the heat sink and the plurality of posts are monolithically formed, and a heat pipe attached to the bottom side of the heat sink with a first end near an electronic component and a second end near one of the plurality of posts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.