Electronic component mounting apparatus
US10420267B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2015 |
| Grant date | Sep 17, 2019 |
| Priority date | — |
| Expiry date | Jan 13, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component mounting apparatus includes: a mounting head including a holder for extracting an electronic component and mounting the electronic component onto a substrate, the mounting head being movable in a horizontal direction; an imaging camera disposed on the mounting head for imaging a component extraction position, when the holder is at the component extraction position; a recognition unit for recognizing, based on an image captured by the imaging camera, a positional deviation between the component extraction position and a position of a housing portion where a component is stored in a component feeding unit or a position of the component in the housing portion; and a controller for correcting the component extraction position to a position shifted by a positional deviation recognized by the recognition unit before the component feeding unit extracts a subsequent component, and causing the mounting head to move to the corrected position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.